fred die in wafer form FD120L03A5. 1 bulletin i0515j rev. a 01/03 not to scale reference package: to-220 www.irf.com 40 (1.57) ? 125 (4.92) notes: 1. all dimensions are shown in millimeters (mils). 2. controlling dimension (mils): 3. dimensions and tolerances: a = 3.048 0.01 (120 0.4) b = 3.048 0.01 (120 0.4) c = 2.714 0.01 (106.8 0.4) d = 2.714 0.01 (106.8 0.4) 4. letter designation: a = anode (top metal) c = cathode (back metal) 5. sawing: recommended blade semitec s1025 qs00 blade sawing street 0.066 0.005 (2.60 0.20) a d 0.35 0.01 c a c b (14 0.4) wafer flat alligned with side b of the die
FD120L03A5. 2 bulletin i0515j rev. a 01/03 www.irf.com parameters units test conditions v fm maximum forward voltage 1.0 v t j = 25c, i f = 15 a v rrm mimunum reverse breakdown voltage 600 v t j = 25c, i rrm = 100 a i rm max. reverse leakage current 10 a t j = 25c, v rrm = 300 v t rr typ. reverse recovery time 85 ns i f = 15a, di/ dt = 200a/s, v r = 200 v mechanical data nominal back metal composition, thickness cr - ni - ag (1 ka - 2 ka - 3 ka) nominal front metal composition, thickness 99% al, 1% si (3 microns) chip dimensions 0.120" x 0.120" (see drawing) reject ink dot size 0.25 mm diameter minimum recommended storage environment storage in original container, in dessicated nitrogen, with no contamination electrical characteristics (wafer form) fd120xxxx5 b inked probed unsawn wafer (wafer in box) 1000 fd120xxxx5 r probed die in tape & reel n/a fd120xxxx5 p probed die in waffle pack 1000 fd120xxxx5 f inked probed sawn wafer on film 1000 device description minimum order quantity # die in sale package packaging
3 FD120L03A5. bulletin i0515j rev. a 01/03 www.irf.com ir world headquarters: 233 kansas st., el segundo, california 90245, usa tel: (310) 252-7105 tac fax: (310) 252-7309 visit us at www.irf.com for sales contact information. 01/03 data and specifications subject to change without notice. this product has been designed and qualified for industrial level. qualification standards can be found on ir's web site. fd 120 l 03 a 5 b 1 2 3 1 - fred die 2 - chip dimension in mils: 120 = 120x120 square 3 - process code l 4 - voltage code vrrm (*100) eg: 03 = 300v 5 - chip surface metallization: a = aluminium (anode), silver (cathode) 6 - wafer diameter in inches 7 - packaging: b = inked probed unsawn wafer (wafer in box) 4 device code ordering information table 6 5 7
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